mobile phone motherboard
Product name: mobile phone motherboardNumber of layers: 12LPlate thickness: 1.0mmPlate: FR-4Copper thickness: 1oz inside and outsideLine width and line spacing: 3milMinimum hole diameter: 0.1mmImpedance requirement: 50/100 ΩSurface treatment: gold depositMain features: HDI 2nd order blind hole, impedance control, 3mil line width and line spacing
computer card board
Product name: computer card boardNumber of layers: 4LPlate thickness: 1.6mmPlate: FR-4Copper thickness: 1oz inside and outsideLine width and line spacing: 4milMinimum hole diameter: 0.2mmImpedance requirement: 50/100 ΩSurface treatment: OSPMain features: BGA, impedance control, 4mil line width and line spacing
6-layer HDI optical module
Product name: 6-layer HDI optical moduleNumber of layers: 6LPlate thickness: 1.0mmPlate: RogersCopper thickness: 1oz inside and outsideLine width and line spacing: 3milMinimum hole diameter: 0.1mmImpedance requirement: 50/100 ΩSurface treatment: nickel palladiumMain features: Rogers, blind buried hole, impedance control, 3mil line width and line spacing, TG185, pan hole, and surrounding half hole.
Industrial control
Industrial controlPart No.: E0226060189CSubstrate thickness: 0.22+/-0.03mmLayer count: 4 layer Material: SI165Minimum trace: 50 umMinimum space(gap): 25 umMinimum hole: 0.25mmSurface finished: ENEPIGUnit size: 200*300mm
Network control board
Name:Network control boardPart No.: E0415060189ALayer count: 4 layerMaterial: FR4, 1.6mm, 1 OZ for all layerMinimum tack: 5 milMinimum space(gap): 5 milMinimum hole: 0.20mmSurface finished: flash gold + Hard gold (Au>3um)Panel size: 228*108mm/24upApplication: SensorCharacteristics: selective hard gold (gold thickness 3um or 120U”), TG150.
PLC control sleeve board
PLC sheathingPart No.: E02021023CPlate thickness: 1.6mmNumber of floors: 2Material: FR4Minimum routing: 50 umMinimum spacing (clearance): 25 umMinimum hole: 0.25mmSurface treatment: ENEPIGUnit size: 158 * 119mm
Mother Board
Name:Network control boardPart No.: E04150569ALayer count: 10 layerMaterial: FR4, 2.5mm, 1 OZ for all layerMinimum tack: 5 milMinimum space(gap): 5 milMinimum hole: 0.20mmSurface finished: flash goldPanel size: 228*108mm/24upApplication: Network control boardCharacteristics: (gold thickness 3um or 120U”), TG170
Food automation equipment
Name: Food Automation ControlPart No.: E0125862ANumber of floors: 2Material: FR4, 1.6mm, 2OZ, applicable to all layersMinimum viscosity: 5 milsMinimum spacing (clearance): 5 milsMinimum hole: 0.20mmSurface treatment: lead-free tin sprayingPanel size: 125.8 * 63.2Application: food packaging
Automobile control panel
Name: Automobile control panelPart No.: E0125992ANumber of floors: 4Material: FR4, 1.6mm, 2OZ,Minimum viscosity: 5 milsMinimum spacing (clearance): 5 milsMinimum hole: 0.20mmSurface treatment: lead-free tin sprayingPanel size: 150MM*120MMApplication: automobile control panel
Optical module
Product name: optical moduleNumber of layers: 8LPlate thickness: 1.0mmPlate: Panasonic M6Copper thickness: 1oz inside and outsideLine width and line spacing: 3milMinimum hole diameter: 0.1mmImpedance requirement: 50/100 ΩSurface treatment: nickel palladiumMain features: Panasonic M6, blind buried hole, impedance control, 3mil line width and line spacing, TG185, pan hole