Ic Substrates

Items	Technology capability
Layer count	2-8 layer
Min finished board thickness	2 layer	0.10mm
	4 layer	0.17mm
	6 layer	0.22mm
	7 layer	0.25mm
	8 layer	0.29mm
Min via/PAD	thru via/PAD	75um/155um
	blind via/PAD	50um/130um
Min trace width/gap	15um/15um
Solder mask registration	+/-20um
Special Process	Tenting
	Etch Back
	Buss-less
	MSAP
	SAP
Surface treatment	ENIG,ENEPIG,Soft Gold, Flash Gold,OSP...
Material Types	HL832-NX,MCL-E-679,HL832-NS,750G, DS-7409,FR5, ABF…