Rigid PCB
Items | Technology capability | |
Layer count | 1-46 layer | |
Max manufacturing size | 1-2 layer | 600mm*1500mm |
Multilayer | 530mm*900mm | |
Board thickness | 0.05mm—10.0mm | |
Copper foil thickness | 0.25OZ-13OZ | |
Min line width/space | 2.5 mil / 2.5 mil | |
Outline tolerance | Punching | +/-0.15mm |
Routing | +/-0.10mm | |
Min hole | Mechanical | 0.15mm |
laser | 0.075mm | |
Impedance control tolerance | +/-8% | |
Aspect ratio | 18:01 | |
Surface treatment | Immersion Gold(ENIG), Immersion Tin, Immersion Silver, Gold Fingers, ENEPIG,Flash Gold, Hard Gold(max Au>3UM), Wire bondable soft gold, lead free HASL, HASL, OSP... | |
Material Types | TG135, TG150, TG180, TG200, TG250; FR4,Polymide, High frequency (RO435B, RO4003C,RO4450F, RT5880, RO3003, F4BM…) | |
Materials suppliers | Shengyi,ITEQ,Rogers,Panasonic,TUC,KB, Berguist… |