Product name: mobile phone motherboard

Number of layers: 12L

Plate thickness: 1.0mm

Plate: FR-4

Copper thickness: 1oz inside and outside

Line width and line spacing: 3mil

Minimum hole diameter: 0.1mm

Impedance requirement: 50/100 Ω

Surface treatment: gold deposit

Main features: HDI 2nd order blind hole, impedance control, 3mil line width and line spacing